3 credits
Fall 2025 Lecture Upper Division
Processing and microstructural development of thin films and layered structures. Includes vapor, liquid, and reactive processing, as well as layer modification by annealing and beam techniques. Offered in alternate years.
Learning Outcomes1List the detailed sequence of steps required for CVD (or sputter or MBE) film deposition and quantify the parametric dependence of these steps.
2Explain the process and film requirements for an epitaxial (or columnar or amorphous) film.
3Discuss the differences between different evaporation processes.
4Compare the advantages and disadvantages of techniques used to suppress reactivity (a) of the materials during deposition and (b) of the material with the substrate.
5Explain the importance of materials and process parameters during laser annealing.
6List material and process critical factors for specific films in at least three different functional classes of film applications.
7Communicate in detail the importance, use, and production method of a particular functional film in a manner understandable by other students.
8Explain the importance and critical issues involved in the following film deposition processes: CVD, PVD, Electrochemical, thermal spray, lithography.
9Explain the broad issues involved in processing each different type of material class: metals, ceramics, polymers, semiconductors, composites, and functionally graded materials.
Prerequisites
Restrictions
made by Purdue students.